Products
Lead Free Series
Reinforced material made of glass fiber, respectively impregnate in resin to make core material, covered with copper foil after high temperature and hot pressing. It is the most used product of printed circuit board, referred to as FR-4. This type of material has single and double sided copper clad laminates. Due to the rapid development of electronic products, the performance requirements of copper clad laminates have gradually increased, and different FR-4 materials have been derived, such as lead-free substrates and high-speed high-frequency boards.
Product list：
Model |
Tg（℃） |
Td（℃） |
CTE（%） |
Dk/Df (@1Ghz) |
Feature |
Appendix |
≥135 |
330 |
3.5 |
4.6/0.016 |
● Anti-CAF ● CTI 175V ● Suitable for lead free process |
||
≥140 |
340 |
3.4 |
4.6/0.016 |
● Anti-CAF (Suitable for Automotive) ● CTI 175V |
||
≥150 |
346 |
3.0 |
4.6/0.016 |
● Anti-CAF (Suitable for Automotive) ● CTI 175V |
||
≥150 |
355 |
2.6 |
4.6/0.016 |
● Anti-CAF (Suitable for Automotive) ● CTI 175V ● 低CTE Low CTE |
||
≥170 |
349 |
2.6 |
4.6/0.016 |
● Anti-CAF (Suitable for Automotive) ● CTI 175V |
||
≥180 |
359 |
2.2 |
4.6/0.016 |
● Anti-CAF (Suitable for Automotive) ● CTI 175V ● 低CTE Low CTE |
