Products

Products

Lead Free Series


       Reinforced material made of glass fiber, respectively impregnate in resin to make core material, covered with copper foil after high temperature and hot pressing. It is the most used product of printed circuit board, referred to as FR-4. This type of material has single and double sided copper clad laminates. Due to the rapid development of electronic products, the performance requirements of copper clad laminates have gradually increased, and different FR-4 materials have been derived, such as lead-free substrates and high-speed high-frequency boards.


Product list:

Model

Tg(℃)

Td(℃)

CTE(%)

Dk/Df

(@1Ghz)

Feature

Appendix

KB-6164

140

330

3.5

4.6/0.016

Anti-CAF

CTI 175V    

Suitable for lead free process

● KB-6164 Processing Guide

KB-6164 line up

KB-6164F

145

340

3.4

4.6/0.016

Anti-CAF (Suitable for Automotive)

CTI 175V   

● KB-6164F Processing Guide

KB-6164F line up

KB-6165

153

348

3.0

4.6/0.016

Anti-CAF (Suitable for Automotive) 

CTI 175V         

/

KB-6165F

157

352

2.8

4.6/0.016

Anti-CAF (Suitable for Automotive) 

CTI 175V         

● KB-6165F Processing Guide

● KB-6165F line up

KB-6165C

157

352

2.8

4.6/0.016

● Anti-CAF (Suitable for Automotive) 

● CTI 600V

/

KB-6165LE

162

355

2.6

4.6/0.016

Anti-CAF (Suitable for Automotive)

CTI 300V    

低CTE Low CTE

● KB-6165LE Processing Guide

● KB-6165LE line up

KB-6167F

175

356

2.6

4.6/0.016

Anti-CAF (Suitable for Automotive)

CTI 175V   

KB-6167F-Processing-Guide

KB-6167F-line-up

KB-6168LE

190

370

2.1

4.6/0.016

Anti-CAF (Suitable for Automotive)

CTI 300V    

低CTE Low CTE

● KB-6168LE Processing Guide

KB-6168LE line up