Kingboard Chemical Holdings Limited first selected as Top 2000 Global Companies         Phase One of PCB Plant in Jiangmen Commences Operation


Products
         
Paper Laminate
 
KB-150/1150/150D Unclad (ANSI :XPC)
KB-150/KB-1150 is a paper based phenolic resin unclad laminate, suitable for precision instruments of mechanical transportation. It has excellent heat and humidity resistance and is suitable for cold punching.
KB-1150/KB-1151 ANSI XPC
KB-1150 and KB-1151 are paper based phenolic resin copper clad laminates. They have good heat and humidity resistance and are suitable for cold punching.
KB-2150G FR-2
KB-2150GC is a non-halogen, antimony-free based phenolic resin copper clad laminate. No toxic residue or exhaust gas generated during combustion.KB-2150GC not only keeps all characteristics of FR-2,but also has a superior heat and humidity resistance.
KB-2151 FR-2
KB-2151 is a paper based phenolic resin copper clad laminate which is suitable for automatic component insertion, high density assembly and surface mounting for printed circuit board manufacturing.
KB-3151C FR-1
KB-3151C is a paper based phenolic resin copper clad laminates with different CTI values up 600V plus, are suitable for automatic component insertion, high density assembly and surface mounting for printed circuit board manufacturing.

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[KB] Address: 2/F., Harbour View 1, No. 12 Science Park East Avenue, Phase II Hong Kong Science Park, Shatin, N.T.